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DoP Extends Deadline for AMD-CF Scheme Applications

Written by : Aishwarya Sarthe

February 15, 2024

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This extension provides additional time for eligible candidates to apply for the scheme, which seeks to enhance medical device clusters' infrastructure.

The Department of Pharmaceuticals (DoP) has extended the deadline for submissions under the Assistance to Medical Device Clusters for Common Facilities (AMD-CF) scheme until March 15, 2024. 

This extension provides additional time for eligible candidates to apply for the scheme, which seeks to enhance medical device clusters' infrastructure. 

Following the initial application invitation on January 11, 2024, the DoP set February 10 as the closing date. However, with a notice addressed to stakeholders, including representatives from the medical devices industry, the DoP has now extended the application window. 

The decision, approved by the competent authority, grants interested parties an opportunity to apply until March 15, 2024. Applications will be submitted through the Udyamimitra portal, facilitating an online application process for eligible applicants.

Vision Behind AMD-CF Scheme

The AMD-CF scheme, introduced with guidelines released on May 9, 2023, allocates a proposed financial outlay of INR 300 Cr. Its primary objective is to provide financial assistance aimed at bolstering existing and new medical device clusters through the establishment of common infrastructure facilities. Additionally, procedures for selecting a Project Management Agency (PMA) for the scheme have been outlined.

Reportedly, industry organizations have lauded the establishment of the AMD-CF scheme, emphasizing its potential to attract both foreign and domestic investments within the MedTech sector. The scheme, comprising two sub-schemes, is anticipated to enhance domestic manufacturing capacity and elevate cluster quality for sustainable growth in the medical devices sector.

Decoding AMD-CF Components 

The AMD-CF scheme encompasses two components or sub-schemes: assistance for common facilities (CF) and assistance for testing facilities (TF). Spanning three years from 2023-24 to 2025-26, the scheme aims to support the establishment or strengthening of 12 common facilities and 12 testing laboratories.

Under the CF sub-scheme, financial assistance amounting to INR 240 Cr is earmarked for common facilities and distributed across the three years. These facilities aim to fortify medical device clusters' capacity for sustained growth by creating shared infrastructure. 

Further, the scheme targets clusters consisting of at least five medical device manufacturing units, either forming a Special Purpose Vehicle (SPV) or promoted by state governments.

The TF sub-scheme, on the other hand, aims to enhance the availability of Medical Device Testing Laboratories. Interested national or state-level government or private institutions can apply for assistance to establish or strengthen testing facilities catering to Class A, B, C, and D medical devices. The scheme also extends eligibility to other legal entities willing to open a separate account for project funds.

Benefits Offered Under The Scheme

Both sub-schemes seek to improve the quality of medical devices, ensure regulatory compliance, enhance the availability of trained personnel, increase competitiveness within clusters, and reduce manufacturing costs. With these objectives in mind, the AMD-CF scheme is expected to foster a conducive environment for the growth and development of the medical devices sector in India.

The extension of the deadline for applications under the AMD-CF scheme reflects the government's commitment to supporting and strengthening the medical devices industry. By providing additional submission time, the DoP aims to encourage wider participation and ensure the effective implementation of the scheme's objectives. 

As the deadline approaches, stakeholders within the medical devices sector are prompted to seize this opportunity to leverage the benefits offered by the AMD-CF scheme for the advancement of the industry.


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